SpyHammer Understanding and Exploiting RowHammer under Fine-Grained Temperature Variations

2025-05-03 0 0 2.38MB 15 页 10玖币
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SpyHammer:
Understanding and Exploiting RowHammer
under Fine-Grained Temperature Variations
Lois Orosa1,2Ulrich Rührmair3,4A. Giray Yağlıkçı1Haocong Luo1Ataberk Olgun1
Patrick Jattke1Minesh Patel1Jeremie Kim1Kaveh Razavi1Onur Mutlu1
1ETH Zürich 2Galicia Supercomputing Center (CESGA)
3LMU München 4University of Connecticut
RowHammer is a DRAM vulnerability that can cause bit er-
rors in a victim DRAM row solely by accessing its neighboring
DRAM rows at a high-enough rate. Recent studies demonstrate
that new DRAM devices are becoming increasingly vulnerable to
RowHammer, and many works demonstrate system-level attacks
for privilege escalation or information leakage. In this work,
we perform the rst rigorous ne-grained characterization and
analysis of the correlation between RowHammer and tempera-
ture. We show that RowHammer is very sensitive to temperature
variations, even if the variations are very small (e.g.,
±1C
).
We leverage two key observations from our analysis to spy on
DRAM temperature: 1) RowHammer-induced bit error rate con-
sistently increases (or decreases) as the temperature increases,
and 2) some DRAM cells that are vulnerable to RowHammer
exhibit bit errors only at a particular temperature. Based on
these observations, we propose a new RowHammer attack, called
SpyHammer, that spies on the temperature of DRAM on critical
systems such as industrial production lines, vehicles, and medical
systems. SpyHammer is the rst practical attack that can spy on
DRAM temperature. Our evaluation in a controlled environment
shows that SpyHammer can infer the temperature of the victim
DRAM modules with an error of less than
±2.5C
at the
90th
percentile of all tested temperatures, for 12 real DRAM modules
(120 DRAM chips) from four main manufacturers.
1. Introduction
RowHammer is a DRAM vulnerability where a DRAM cell
experiences a bitip when its nearby cells are rapidly and fre-
quently accessed [1]. Recent works [2, 3] demonstrate that
modern DDR4 DRAM devices are more vulnerable to Row-
Hammer than their predecessor DDR3 devices, suggesting that
RowHammer is an important DRAM system design concern
that is becoming increasingly severe as DRAM manufactur-
ing technology nodes scale down. Using RowHammer, many
works demonstrate attacks that escalate privilege at system-
level, leak secret information, and manipulate critical applica-
tion outputs [3–33].
We perform the rst rigorous ne-grained characterization
and analysis of the correlation between RowHammer and tem-
perature, which lead to eight insightful observations and three
key takeaways. Based on our observations and takeaways, we
demonstrate SpyHammer, a new attack that uses RowHammer
to spy on DRAM temperature with high accuracy. Our attack
can be performed with minimal knowledge of the target com-
puting system and can be used to compromise the security,
condentiality and privacy of critical systems that use DRAM.
SpyHammer can compromise a victim computing system to
achieve two goals. First, it can identify the utilization of a
computer system, as the compute and memory intensity of a
workload can change the temperature of the system. For ex-
ample, an attacker can use SpyHammer to infer when a server
is at its peak utilization by spying on its temperature. Second,
SpyHammer can measure the ambient temperature, which may
convey information about the state of a larger system that con-
tains the target computing system (e.g., a car, a drone, or an
industrial manufacturing machinery). For example, the tem-
perature of a car’s engine may rise if the engine is operating
at high revolutions per minute.
SpyHammer not only compromises security and conden-
tiality, but also privacy. For example, by spying the tempera-
ture of a house (or dierent rooms of a house), an attacker can
infer the habits of the person(s) living in that house. Tracking
the temperature could give information about at which times
the person(s) leave or enter a room in the house.
SpyHammer leverages two key observations about Row-
Hammer to spy on DRAM temperature: 1) RowHammer-
induced bit error rate consistently increases (or decreases)
when temperature increases, and 2) some DRAM cells that
are vulnerable to RowHammer experience bit errors only at a
specic temperature. Using these observations, SpyHammer
infers the temperature of DRAM chips by only characterizing
DRAM cells that exhibit RowHammer-induced bit errors in the
address space of the attacker without requiring any hardware
or system software modications. We propose two variants of
the SpyHammer attack, each with a dierent threat model.
The rst variant of SpyHammer can identify relative tem-
perature changes, and it does not require prior physical access
to or knowledge about the victim DRAM module. We observe
that the correlation between Bit Errors per Row (
BER
) and
temperature follows a similar trend in dierent DRAM mod-
ules of the same model and manufacturing date. We use this
observation to spy on relative temperature changes. The key
idea is to infer the model and manufacturing date of the victim
DRAM module, and use a module with the same characteris-
arXiv:2210.04084v2 [cs.CR] 2 Jun 2024
tics (to which the attacker has physical access and can control
the operating temperature of) to infer the correlation between
BER
and temperature of the victim DRAM module. Since
the attacker has no prior information about the victim DRAM
module, the attacker must reverse engineer the victim DRAM
module using remote RowHammer-based techniques [18, 34].
To estimate the temperature of the victim DRAM module, we
propose to build a polynomial regression model using a DRAM
module that has similar characteristics as the victim DRAM
module.
The second variant of SpyHammer spies on absolute temper-
atures, which requires characterizing the victim DRAM module
before the attack. The key idea is to build an accurate polyno-
mial regression model using the characterization data of the
victim DRAM module. This model is then used in the attack
to accurately infer the victim DRAM module’s temperature.
Reliably monitoring the
BER
of a DRAM module requires
the attacker to hammer a large region of memory, which might
increase the complexity of the attack. To reduce the number
of DRAM accesses to the victim DRAM module, we propose a
SpyHammer optimization that leverages the observation that
some DRAM cells experience bitips only at one particular
temperature. We call these cells canary cells.1
The enrollment phase identies the canary cells of the
DRAM module. In this process, the cells that ip at only one
temperature are added to the canary cell set. After the enroll-
ment phase, an attacker can estimate the temperature of the
victim DRAM by monitoring only a few selected canary cells,
which reduces the number of memory accesses required to
perform the attack.
To evaluate SpyHammer, we perform an extensive and thor-
ough DRAM RowHammer characterization on 12 real DRAM
modules (120 DRAM chips) using a temperature resolution of
1C
in a controlled environment. Our results show that our
methodology can infer 1) absolute temperatures (with prior
characterization of the victim DRAM module) with an error of
±2.5C
, and 2) relative temperature changes (without prior
characterization of the victim DRAM module) with an error
of
±3.5C
, for all 12 DRAM modules we test, at the
90th
per-
centile of tested temperature points (i.e., from
50 C
to
95 C
,
with 1Cstep size).
We make the following main contributions:
We perform the rst rigorous ne-grained characterization
and analysis of the correlation between RowHammer and
temperature using 12 real DDR4 DRAM modules (120 DRAM
chips).
We show that RowHammer is very sensitive to temperature
variations, even if the variations are very small (e.g.,
±1C
).
We propose SpyHammer, the rst RowHammer attack that
can spy on DRAM temperature without any modication
to the victim system. SpyHammer uses only the attacker’s
memory space to perform the attack (i.e., it does not corrupt
1
In all possible temperature points within a temperature range (given a
particular temperature resolution), a canary cell experiences a bitip at one
and only one temperature point.
the victim’s memory space).
We propose two variants of SpyHammer: 1) a variant that
can spy on relative temperature changes without any prior
information about or changes to the victim DRAM module,
and 2) a variant that can spy on absolute temperature changes
when the attacker has physical access to the victim DRAM
module before deploying the attack.
We perform a detailed study of the accuracy of the two
SpyHammer variants, which shows that an attacker can spy
with a maximum error of 1)
±2.5C
on absolute temperature
values, and 2)
±3.5C
on relative temperature changes, in
all 12 DRAM modules (120 DRAM chips) from the four major
manufacturers we test.2
2. Background
We provide a brief introduction to DRAM organization and
RowHammer vulnerability. For more detailed background, we
refer the reader to prior works [1–3,35–77].
2.1. DRAM Organization
The memory controller communicates with DRAM modules
over one or more DRAM channels. Each module contains
a set of DRAM chips that operate in lockstep. The DRAM
cells within a DRAM chip are organized hierarchically. A
DRAM chip comprises multiple DRAM banks that can operate
independently. DRAM cells in a DRAM bank are laid out in a
two-dimensional structure of rows and columns. Each DRAM
cell on a DRAM row is connected to a common wordline via
access transistors. A bitline connects a column of DRAM cells
to a DRAM sense amplier to access data.
Accesses to DRAM devices are typically performed in cache
block granularity (64-bytes) in contemporary systems. An
access to a DRAM cache block works in three steps. First,
the memory controller sends an ACT command to activate a
specic row within a DRAM bank, which prepares the row
for a columns access (i.e., copies the row to the sense ampli-
ers). Second, the memory controller sends a READ (WRITE)
command to read (write) a column in the row. Third, once all
operations to the active row are completed, the memory con-
troller sends a PRE command that closes the row and prepares
the DRAM bank to open a new DRAM row (i.e., it precharges
the bank).
2.2. RowHammer
Modern DRAM devices are subject to disturbance failures
caused by high frequency accesses (i.e., hammer) to DRAM
rows (i.e., aggressor rows) that result in bitips in physically
nearby rows that are not being accessed (i.e., victim rows). This
phenomenon is referred to as RowHammer [1,2, 15, 23, 78
81].
RowHammer-induced bitips are exacerbated as DRAM tech-
nology nodes shrink and DRAM cells come closer to each
other. This results in newer, higher-density DRAM chips to
become more vulnerable to RowHammer [2] and other read
disturbance eects [75]. These bitips manifest after a row’s
2At the 90th percentile of tested temperature points
2
activation count reaches a certain threshold value within a
refresh window (usually denoted as MAC [82] or
HCf irst
[2]).
Prior works devise many dierent RowHammer-based at-
tacks, such as denial of service [17, 18], privilege escala-
tion [4
7, 9, 17, 18, 22, 31, 83, 84], secret data leakage [25, 32, 33],
manipulation of the application correctness [24, 30] or private
key recovery [85,86]. A subset of these attacks require no phys-
ical access to a victim computing system; for example, attacks
leveraging RDMA [34] or attacks in JavaScript programs [6].
3. Methodology
In order to thoroughly characterize the correlation between
RowHammer and temperature and analyze the potential of the
SpyHammer attack, we use an FPGA-based infrastructure that
allows us to avoid uncontrolled interference in the system that
might skew the results and lead to wrong insights and conclu-
sions. To perform a SpyHammer attack on a real commodity
computer system, we can use the methodology proposed in
previous works [3,31, 87] (not demonstrated in this paper).
3.1. Testing Infrastructure
We experimentally study DDR4 DRAM chips across a wide
range of temperatures. We use the DRAM Bender frame-
work [88, 89], which supports DDR4 modules, and a highly
accurate temperature controller infrastructure.
3.1.1. DRAM Bender. Figure 1 shows the DRAM Bender setup
for testing DDR4 DRAM modules. We use the Xilinx Alveo
U200 [90] FPGA board in all of our tests.
(a)$Temperature$
Controller
(b)$DRAM$+$Heater
(c)$FPGA
Figure 1: DRAM Bender Infrastructure: (a) temperature con-
troller, (b) DRAM module clamped with heater pads, and
(c) FPGA board programmed with DRAM Bender
[88].
We use an FPGA board with DRAM Bender (Figure 1c) to
perform all our RowHammer tests. We monitor and adjust the
temperature of DRAM chips under test with a temperature
controller (Figure 1a). This infrastructure provides us with ne-
grained control over the timing between DRAM commands.
We enforce all timing parameters dened by JEDEC [82] to
ensure reliable operation.
3.1.2. Temperature Controller. To regulate the temperature
in DRAM modules, we use silicone rubber heaters pressed to
both sides of the DDR4 module (Figure 1c). To reduce the
heat leakage, we apply two layers of insulation around the
DRAM module under test and the heater pads: 1) a layer of
reective aluminum sheets covering the DRAM and the heater
pads and 2) a layer of insulation sheets made of PTFE, a heat-
resistant material. To measure the actual temperature of DRAM
chips, we use a thermocouple, which we place between the
rubber heaters and the DDR4 chips. We connect the heater
pads and the thermocouple to a Maxwell FT200 temperature
controller (Figure 1a), which keeps the temperature stable by
implementing a closed-loop PID controller. Our host machine
communicates with the temperature controller via an RS485
channel. Using this feature, we build custom software that
enables us to automate the management of the temperature
and integrate it into our testing infrastructure. In our tests
using this infrastructure, we measure temperature with an
accuracy of ±0.1C.
3.2. Testing Methodology
Disabling Sources of Interference. We disable all DRAM
self-regulation events except the calibration signals, such as
ZQ, for signal integrity so that we ensure that the observed
errors are solely caused by RowHammer. We also make sure
that our tests nish before retention errors manifest.
To the best of our knowledge, we also disable all DRAM-
level (e.g., TRR [82]) and system-level RowHammer mitigation
mechanisms (e.g., pTRR [91]) along with all forms of rank-level
error-correction codes (ECC), which could obscure RowHam-
mer bitips. Based on the prior work’s observations [2, 3],
on-DRAM-die RowHammer mitigation mechanisms (i.e., TRR)
take action when the DRAM services a refresh (REF) command.
The DRAM modules we test do not implement error correction
internally.
RowHammer Access Sequence. We use a common access
sequence used in previous works [1, 2, 78] as the worst-case
access pattern, in which we 1) hammer the two rows that are
adjacent to the victim row (i.e., aggressor rows), and 2) access
the aggressor rows as frequently as possible. In our tests, we
perform a double-sided RowHammer attack [1, 2].
Data Pattern. We conduct our experiments on a DRAM mod-
ule by using the module’s worst-case data pattern (
W CDP
).
We identify the
W CDP
as the pattern that experiences the
largest number of bitips among seven dierent data patterns
that prior research on DRAM characterization uses [2,36, 46
49, 58], presented in Table 1: colstripe, checkered, rowstripe,
and random (we also test the complements of the rst three).
For each RowHammer test, we write the corresponding data
pattern to the victim row (
V
in Table 1), and to the 8 previous
(V[1...8]) and next (V+ [1...8]) physically-adjacent rows.
Table 1: Data patterns used in our RowHammer analyses.
Row Address ColstripeCheckeredRowstripeRandom
V±[0,2,4,6,8] 0x55 0x55 0x00 random
V±[1,3,5,7] 0x55 0xaa 0xff random
Vis the physical address of the victim row
We also test the complements of these patterns
Metrics. We compare the
BER
across all our tests at a con-
stant hammer count of 150K per aggressor row. We also iden-
tify the DRAM cells that ip only at a particular temperature
point (i.e., canary cells).
3
摘要:

SpyHammer:UnderstandingandExploitingRowHammerunderFine-GrainedTemperatureVariationsLoisOrosa1,2UlrichRührmair3,4A.GirayYağlıkçı1HaocongLuo1AtaberkOlgun1PatrickJattke1MineshPatel1JeremieKim1KavehRazavi1OnurMutlu11ETHZürich2GaliciaSupercomputingCenter(CESGA)3LMUMünchen4UniversityofConnecticutRowHammer...

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