1 Wafer -scale detachable monocrystalline Germanium nanomembranes for the growth of III-V materials and substrate reuse

2025-04-28 0 0 908.82KB 17 页 10玖币
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Wafer-scale detachable monocrystalline Germanium nanomembranes for the growth of
III-V materials and substrate reuse
Nicolas Paupy1,2, Zakaria Oulad Elhmaidi1,2, Alexandre Chapotot1,2, Tadeáš Hanuš1,2, Javier
Arias-Zapata1,2, Bouraoui Ilahi1,2, Alexandre Heintz1,2, Alex Brice Poungoué Mbeunmi1,2,
Roxana Arvinte1,2, Mohammad Reza Aziziyan1,2, Valentin Daniel1,2, Gwenaëlle Hamon1,2,
Jérémie Chrétien1,2, Firas Zouaghi1,2, Ahmed Ayari1,2, Laurie Mouchel1,2, Jonathan
Henriques1,2, Loïc Demoulin1,2, Thierno Mamoudou Diallo1,2, Philippe-Olivier Provost1,2,
Hubert Pelletier1,2, Maïté Volatier1,2, Rufi Kurstjens3, Jinyoun Cho3, Guillaume Courtois3,
Kristof Dessein3, Sébastien Arcand4, Christian Dubuc4, Abdelatif Jaouad1,2, Nicolas
Quaegebeur5, Ryan Gosselin6, Denis Machon2,7, Richard Arès1,2, Maxime Darnon1,2 &
Abderraouf Boucherif1,2*
1- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, 3000
Boulevard de l’Université, Sherbrooke, J1K 0A5, QC, Canada
2- Laboratoire Nanotechnologies Nanosystèmes (LN2) - CNRS IRL-3463, Université de Sherbrooke,
3000 Boulevard Université, Sherbrooke, Québec J1K OA5, Canada
3- Umicore Electro-Optic Materials, Watertorenstraat 33, 2250, Olen, Belgium
4- Saint-Augustin Canada Electric Inc.
75 rue d’Anvers, Saint-Augustin, G3A 1S5, QC, Canada
5- Department of Mechanical Engineering, Université de Sherbrooke, 2500 Boulevard de l’Université,
Sherbrooke, J1K 2R1 QC, Canada
6- Department of Chemical and Biotechnological Engineering, Université de Sherbrooke, 2500
Boulevard de l’Université, Sherbrooke, J1K OA5, QC, Canada
7- Institut Lumière Matière, UMR5306 Université Lyon 1-CNRS, Université de Lyon F-69622
Villeurbanne cedex, France
*Corresponding author. Email: abderraouf.boucherif@usherbrooke.ca
Keywords: Germanium nanomembrane, mesoporous Ge, template for III-V epitaxy, Substrate
reuse, layer lift-off, X-ray diffraction, Transmission electron microscopy of semiconductors.
Germanium (Ge) is increasingly used as a substrate for high-performance
optoelectronic, photovoltaic, and electronic devices. These devices are usually grown on thick
and rigid Ge substrates manufactured by classical wafering techniques. Nanomembranes (NMs)
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provide an alternative to this approach while offering wafer-scale lateral dimensions, weight
reduction, limitation of waste, and cost effectiveness. Herein, we introduce the Porous
germanium Efficient Epitaxial LayEr Release (PEELER) process, which consists of the
fabrication of wafer-scale detachable monocrystalline Ge NMs on porous Ge (PGe) and
substrate reuse. We demonstrate monocrystalline Ge NMs with surface roughness below 1 nm
on top of nanoengineered void layer enabling layer detachment. Furthermore, these Ge NMs
exhibit compatibility with the growth of III-V materials. High-resolution transmission electron
microscopy (HRTEM) characterization shows Ge NMs crystallinity and high-resolution X-ray
diffraction (HRXRD) reciprocal space mapping endorses high-quality GaAs layers. Finally, we
demonstrate the chemical reconditioning process of the Ge substrate, allowing its reuse, to
produce multiple free-standing NMs from a single parent wafer. The PEELER process
significantly reduces the consumption of Ge during the fabrication process which paves the way
for a new generation of low-cost flexible optoelectronics devices.
1. Introduction
Free-standing semiconductor nanomembranes (NMs) draw tremendous attention in
nanoscience and engineering for their unique mechanical stability and structural properties.[1]
In this regard, they represent a powerful technology for monocrystalline growth, layer release,
and transfer to any target substrate.[2] Besides, this scheme allows significant substrate material
reduction compared to conventional substrates manufactured by classical wafering
techniques[3,4]. This is especially interesting in the case of expensive materials.[5] Furthermore,
thin NMs enable the improvement of semiconductor properties and the manufacture of novel
devices such as memories and sensors,[6] high-performance photodetectors,[7] and photovoltaic
devices.[8]
Ge NMs attract special attention since the intrinsic properties of Ge grants the growth
compatibility with a wide range of III-V alloy materials.[9,10] Moreover, Ge NMs benefit from
flexibility and lightweight for the fabrication of high efficiency and flexible optoelectronic
devices.[11] Additionally, vertical miniaturization of optoelectronic devices was recently shown
using Ge NMs.[12,13] Some challenges are yet to be overcome to achieve widespread commercial
adoption of Ge NMs including (a) a cost-effective and viable fabrication process; (b) wafer-
scale application (c) compatibility with the semiconductor manufacturing procedures.
Ge NMs and substrate reuse offer a solution to reduce the overall consumption of Ge,
which is a critical raw material. Moreover, the use of Ge NMs would greatly reduce the weight
of III-V triple-junction solar cells on Ge substrate, which represents more than 90% [14] of the
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total mass of the solar cell. The use of NMs would also allow the reduction of the Ge substrate
thickness (below 60 um[14]), which has been shown to be a key technology for the next
generation of space and some terrestrial applications, like electric cars, drones or wearable
electronic devices.
This strategy further complements the on-going efforts to develop a sustainable process
flow from Ge extraction to device processing.[13] Different techniques for detachable layers and
substrate reuse have been proposed: Epitaxial lift-off of layers (ELO) using a selective chemical
etching of a sacrificial layer to release the “active” epitaxial layer.[15] ELO is the most
widespread technique proposed in the literature. However, at wafer-scale the ELO process
copes with some challenges, such as thin-film handling and alignment for device fabrication.[16]
Another technique that has been the subject of recent research for : controlled spalling[17]. It has
been shown that the substrate can be reused, but this technique generates many defects, which
will strongly impact the performance of the devices.
Recently, another technique called Germanium-on-Nothing (GoN) uses a sequence of
lithography, plasma etching, and annealing steps to create a weak void layer used for the
detachment. However, this approach increases the substrate reuse cost and the complexity of
the process.[18] Other layer detachment and substrate reuse methods were demonstrated such as
laser lift-off,[19] Ge-on-Ge lift-off[20] and double-layer porosification lift-off.[21]
Nonetheless, none of the preceding techniques have successfully demonstrated all the following
points necessary for a wide adoption of the method: (1) fabrication of detachable and mono-
crystalline Ge NMs (2) wafer-scale application (3) cost effective reconditioning of the substrate
after NMs detachment (4) Multiple re-uses of the parent substrate.
In the present work, we introduce the Porous germanium Efficient Epitaxial LayEr
Release (PEELER) process for wafer-scale growth of monocrystalline Ge NMs and their
detachment, compatible with Ge substrates reuse. This approach consists of four key steps: (i)
Wafer-scale porosification by bipolar electrochemical etching (BEE) of a 100 mm, off-cut
Ge wafer (ii) Growth of a monocrystalline Ge on porous Ge (PGe) by molecular beam epitaxy
(MBE) (iii) Ge NMs detachment from the substrate (iv) Substrate reconditioning by chemical
etching to enable reuse of the substrate and cycle repetition.
Furthermore, we provide detailed microstructural investigations of the epitaxial Ge NMs by
High-resolution transmission electron microscopy (HRTEM). The chemical beam epitaxy
(CBE) growth of single-phase GaAs on Ge NMs shows the suitability of this type of substrate
for the growth of III-V heterostructures. Compared to the traditional epitaxy on conventional
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Ge wafers, the analysis of the Ge consumption of the PEELER process testifies considerable
reduction of the total Ge material used for the production of high-performance devices.
2. Results and Discussion
Approach
The PEELER approach is illustrated by four steps as shown in the Figure 1. The first
step (i) involves forming a single PGe layer on a 100 mm Ge substrate with misorientation
toward (111). (ii) After chemical cleaning and low temperature annealing (LT), Ge buffer layer
has been first deposited at LT followed by high-temperature (HT) annealing step to reorganize
the porous layer into weak voided layer below the Ge buffer. Then, a high-quality Ge layer is
grown on top to form the Ge NM at higher temperatures. (iii) This Ge NM is detached
mechanically from the substrate (iv) Finally, the parent substrate is reconditioned by an
optimized chemical polishing and the process is repeated to produce more NMs.
Figure 1. Schematic illustration of Ge NMs fabrication and substrate reuse process by the
PEELER approach.
Epitaxial Growth of Ge NMs on PGe
The PEELER cycle starts with the formation of a uniform PGe layer by bipolar
electrochemical etching (BEE). The cross-sectional SEM view (Figure 2a) shows a well-
defined interface between the PGe layer with sponge-like morphology and the bulk Ge material.
Non-destructive ellipsometry mapping with 49 measurement points was used to determine the
PGe layer characteristics and to evaluate its uniformity over the entire 100 mm wafer (Figure 2b
摘要:

1Wafer-scaledetachablemonocrystallineGermaniumnanomembranesforthegrowthofIII-VmaterialsandsubstratereuseNicolasPaupy1,2,ZakariaOuladElhmaidi1,2,AlexandreChapotot1,2,TadeášHanuš1,2,JavierArias-Zapata1,2,BouraouiIlahi1,2,AlexandreHeintz1,2,AlexBricePoungouéMbeunmi1,2,RoxanaArvinte1,2,MohammadRezaAzizi...

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