Supporting Electronics Learning through Augmented Reality
2025-05-02
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Supporting Electronics Learning through Augmented Reality
Thomas Kosch
thomas.kosch@hu-berlin.de
HU Berlin
Berlin, Germany
Julian Rasch
julian.rasch@i.lmu.de
LMU Munich
Munich, Germany
Albrecht Schmidt
albrecht.schmidt@i.lmu.de
LMU Munich
Munich, Germany
Sebastian Feger
sebastian.feger@i.lmu.de
LMU Munich
Munich, Germany
Figure 1: A mock up of a non-functional augmented electronics breadboard. A smartphone app analyzes the functionality and
correctness of the circuit by detecting the congured circuit and spatially projecting virtual elements on the circuit compo-
nents.
ABSTRACT
Understanding electronics is a critical area in the maker scene.
Many of the makers’ projects require electronics knowledge to
connect microcontrollers with sensors and actuators. Yet, learning
electronics is challenging, as internal component processes remain
invisible, and students often fear personal harm or component
damage. Augmented Reality (AR) applications are developed to
support electronics learning and visualize complex processes. This
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CHI ’22, April 29-May 5, 2022, New Orleans, LA, USA
©2022 Association for Computing Machinery.
ACM ISBN 978-1-4503-XXXX-X/18/06. . . $15.00
https://doi.org/10.1145/nnnnnnn.nnnnnnn
paper reects on related work around AR and electronics that char-
acterize open research challenges around the four characteristics
functionality, delity, feedback type, and interactivity.
CCS CONCEPTS
•Human-centered computing →Interactive systems and tools
.
KEYWORDS
Augmented Electronics; Learning; Circuit Engineering;
ACM Reference Format:
Thomas Kosch, Julian Rasch, Albrecht Schmidt, and Sebastian Feger. 2022.
Supporting Electronics Learning through Augmented Reality. In Confer-
ence on Human Factors in Computing Systems, April 29-May 5, 2022, New
Orleans, LA, USA. ACM, New York, NY, USA, 5 pages. https://doi.org/10.
1145/nnnnnnn.nnnnnnn
arXiv:2210.13820v1 [cs.HC] 25 Oct 2022
摘要：
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SupportingElectronicsLearningthroughAugmentedRealityThomasKoschthomas.kosch@hu-berlin.deHUBerlinBerlin,GermanyJulianRaschjulian.rasch@ifi.lmu.deLMUMunichMunich,GermanyAlbrechtSchmidtalbrecht.schmidt@ifi.lmu.deLMUMunichMunich,GermanySebastianFegersebastian.feger@ifi.lmu.deLMUMunichMunich,GermanyFigur...
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分类：图书资源
价格：10玖币
属性：5 页
大小：3MB
格式：PDF
时间：2025-05-02
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