2
The purpose of this paper is to re-visit the analysis in Ref. [4] for the situation of electromigration bias of surface
diffusion. In the next section we set up the base electromigration model, which is followed by the analysis in sections
IV A-IV C.
Remark 1. Our physico-mathematical model is firmly rooted in the classical analysis of morphological evolution of
solid surfaces by surface diffusion of adsorbed atoms, i.e. the mobile atoms in the surface layer, as was pioneered by
Mullins [51] and Cahn and co-workers [52]. In the decades since the model was introduced, it has proved its usefulness
and validity countless times, as is evidenced by the publications cited above. This author believes that it makes
little sense to pile up the physical effects until the primary effect of interest (electromigration) is well understood
in the context of morphological stability, evolution, and breakup of nanowires. This paper is the first step in that
direction. Notice that in a Mullins-type model an effect is introduced via a term in a chemical potential of adatoms,
i.e. effects are additive [50, 51]. Additional effects may be introduced and analyzed in the future, including some
mentioned above and a more complex ones, such as thermal runaway - a harmful side effect of Joule heating that
may result in a wire meltdown as its radius at the point of rupture tends to zero [53]. Regarding electromigration, a
classical phenomenon in solid state physics, inexplicably, its effect on morphological stability and evolution of wires
was not considered theoretically or computationally. This gap in the knowledge is particularly striking, given that
applied physics and phenomenology of electromigration-driven breakup of nanowires has been a fairly active area of
experiment research in the community of nanoelectronics and device reliability engineers since at least 2004 (the year
of the earliest publication this author was able to find; see Ref. [54] for comprehensive review of the progress recently
made).
Remark 2. Studies of charged liquid jets subjected to applied electric fields proliferate in the theoretical fluid
mechanics community, see e.g. Ref. [55] and the references therein. In Ref. [55] it is shown that the axial electric
field will promote the predominance of asymmetric (i.e., non-axisymmetric) instability over the axisymmetric mode,
which causes the bending motion in most experimental observations. Whether similar situation occurs for solid wires
subjected to surface electromigration remains to be seen in a future computational study of morphological evolution
[16–18, 20]. Without electromigration, it was shown that for free-standing wires the axisymmetric instability is
dominant [5] (at least when the surface energy is isotropic).
II. THE MODEL
In this section the base model of wire morphological evolution in the applied electric field is set up, starting from the
geometry of a wire on a substrate. Surface energy anisotropy, bulk and contact line stresses, wetting, and other factors
complicating analysis are ignored. Apart from introducing surface electromigration via the term ∇s·[M(φ)Ecos (φ)ey]
[24, 31, 33] in Eq. (1) and the corresponding modification in the boundary condition (8), the mathematical statement
of the model is identical to Ref. [4] (see below for the description of all mathematical symbols and physical quantities
seen here). The notations follow closely Refs. [4, 24].
A mere local approximation for the surface electric field will be assumed, since it yields the correct result for the
real part, σrof the rate of growth or decay of the perturbation from the initial surface morphology [32]. σrcompletely
characterizes the film instability, which is the goal of this paper. Non-local electric field via the solution of the
boundary-value problem for the electric potential leads to a non-zero imaginary part of σ[24, 31, 56], i.e. a waves
traveling on the surface, emerge. Analysis of traveling waves is deferred to future work.
It will be seen that the base model admits a semi-analytical solution for neutral stability only, that is, in contrast
to Ref. [4], analytical determination of the instability growth rate (the dispersion relation) is analytically impossible
even for this base model. Valuable insights are gained from the analytical solution of neutral stability. It is expected
that accounting for any additional physical effect will require a fully numerical solution of a (linear) stability problem
(and, of course, of a nonlinear morphology evolution problem).
After a growth process has ended, a section of a cylindrical monocrystalline wire of the radius R0is sitting on a
substrate. A wire surface is making the angle αwith the substrate at both contact lines, with 0 < α < π. A set of
cylindrical coordinates (r, θ, y) is introduced, where the angle θis the angular coordinate measured counter-clockwise
from the x-axis, and yis the coordinate along the wire axis (Fig. 1). The wire and the contact lines are infinite in
the ydirection. A wire of constant radius R0is then described as r=R0for θ0≤θ≤π−θ0, where 0 ≤θ0≤π/2.
The contact lines for this wire are located at θ=θ0and at θ=π−θ0. Also, θ0=π/2−α, if 0 < α ≤π/2, or
θ0=α−π/2, if π/2< α ≤π. This wire is the equilibrium shape. A constant electric field E0is applied along the wire
axis (the y-axis), inducing electromigration on the wire surface. Thus the wire surface evolves due to surface diffusion
and electromigration. At α=πa full-circular wire is free-standing, i.e. there is no contact with the substrate (in
fact, it is near impossible to grow a full-circular wire on a substrate [11, 12]).